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Chemistry · L3 · Electroplating with copper

A copper anode dissolves into solution while copper ions are reduced and deposit onto the object being plated, the cathode.

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DC power sourceObject to plate(cathode)Copper anodeCuSO4 solution(Cu2+ ions)Cu2+ + 2e- -> Cuobject gains a copper coating− terminal+ terminalCu -> Cu2+ + 2e- copper dissolvesCu2+ ions migrate to the cathode
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