Shared flowchart

Chemistry · L3 · Electroplating with copper

A copper anode dissolves into solution while copper ions are reduced and deposit onto the object being plated, the cathode.

by @openstemUpdated Chemistry
DC power sourceObject to plate(cathode)Copper anodeCuSO4 solution(Cu2+ ions)Cu2+ + 2e- -> Cuobject gains a copper coating− terminal+ terminalCu -> Cu2+ + 2e- copper dissolvesCu2+ ions migrate to the cathode

We use privacy-friendly product analytics (no session recording, PII masked) to improve OpenStem. Load analytics? Privacy Policy